ALLVIA, Inc. provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.
ALLVIA, a leader in TSV development, provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.
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These void-free copper posts illustrate ALLVIA's ability to successfully fill vias with challenging dimensions.We can fill vias with diameters as small as 30µ and depths to 500µ. Our 25,000 s.f. clean room facility can service prototypes and small production runs.
NEWS
May 1, 2018; ALLVIA Adds Capabilities for Through-Quartz Vias, Reducing Foundry Cycle Times and Improving Interposer Product Quality
Silicon Valley foundry installs state-of-the-art via-making equipment to better serve the growing 2.5D and 3D semiconductor markets more ››
Who coined the term TSV?
Read Moore's Law, the Z Dimension, an article by Sergey Savastiouk that first appeared in the January 2000 issue of Solid State Technology magazine. (PDF, 243k)