ALLVIA, a leader in Through-Silicon Via (TSV) development, provides 3D IC design and 3D internet software development. ALLVIA offers services for prototyping and volume production runs as well as code writing for 3D internet software applications.

ALLVIA Semiconductor Group offers a full lineup of Silicon Interposer processing and Through-Silicon Via (TSV) services for customers seeking quick turn custom R&D applications for 3D chip integration and manufacturing. Turn Key Solutions as well as single step processing are available. Time to market can be significantly reduced by utilizing our Through-Silicon Via expertise.

• Quick Turns in as little as 4 weeks
• Over seven years of via production
• Contact us today for a custom solution

ALLVIA Software Group develops proprietary algorithms for 3D internet software modelling of IC designs and decision making processes.