Sunnyvale, California, 4 February, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in its next round of funding to expand manufacturing facilities and to build more capacity. This brings the total funding invested in the company to $25 million.
Driven by the need for improved performance and the reduction of timing delays in integrated circuits, TSV technology uses short vertical interconnects to replace the long interconnects found in 2-D structures. 3-D with TSV options include stacked wafer, die on wafers, or die-on-die structures.
ALLVIA has been producing TSVs for over five years, providing development work for advanced vertical interconnects and System-in-Package (SiP) solutions. For the past three years the company has generated revenue with its TSV work. With in-house processing equipment, a long history of intellectual property (IP) and a fabrication facility in Sunnyvale, California, ALLVIA offers prototyping services and volume production runs.
ALLVIA, Inc. (http://www.allvia.com/) provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.
A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.