First Through-Silicon Via Foundry, ALLVIA, Selects SunSil for Semiconductor Sales and Marketing Support in the U.S.


Recent through-silicon via (TSV) work with interposers and new funding spark ALLVIA's expansion

Sunnyvale, California, July 7, 2009

ALLVIA, the first through-silicon via (TSV) foundry, has hired SunSil Inc. to sell and market their products and services in the United States. SunSil is a global technical sales and marketing company representing leading semiconductor equipment, materials and manufacturing services companies. With significant industry experience on staff, SunSil has two Silicon Valley locations and offices worldwide.

ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They recently announced they had secured a next round of funding, bringing the total invested in the company to $25 million, and were using the new funds to build more manufacturing capacity.

Through-Silicon Via - Interposer

"With our recent TSV work with flip chips on the backside, we have been able to produce a silicon interposer cost-effectively. This advancement has gained nice traction in the industry and it makes sense now to begin our global expansion," commented Sergey Savastiouk, CEO of ALLVIA. "It will be SunSil's mission to tell the story that ALLVIA TSVs can help curb the rise in substrate costs and eliminate the requalification process for 3D integration."

As new feature size shrinks and the pitch changes, die typically need to be requalified. Silicon interposers by ALLVIA eliminate this process requalification problem. Also, during these shrinks, the substrate becomes more and more expensive. Most savings from the feature size shrink is offset by the more expensive substrate. The ALLVIA 3D integration process will allow features and pitches to shrink without a major rise in substrate costs.

3D Integration

"The various compositions of substrate materials make stacking them for 3D integration difficult due to different coefficients of thermal expansion," commented Seth Alavi, SunSil President and CEO. "ALLVIA has solved the problem by putting a silicon interposer between two stacked substrates and connecting them with TSVs. As more and more semiconductor companies are looking to TSVs to solve process problems, we are excited to be representing ALLVIA."


ALLVIA, Inc. ( provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:

Sergey Savastiouk, CEO

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA