Finally! A Semiconductor Technology Company is Expanding. Through-Silicon Via Foundry, ALLVIA, Acquires Manufacturing Site in Oregon


Semiconductor equipment tool selection process to begin shortly; benefits of Oregon manufacturing expansion include talent pool and lower operating costs

Sunnyvale, California, Oct. 22, 2009

ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of cleanroom capacity. The cleanroom is expandable to 80,000 square feet.

Manufacturing facility exteriorOver the next several months ALLVIA will proceed with manufacturing equipment tool selection for through-silicon via production. They expect the facility to be operational in 2010 but no specific opening date has yet been established.

Currently ALLVIA manufactures in Sunnyvale, CA, offering TSV prototyping and volume production. The company will keep both facilities operational for the foreseeable future and gradually move full volume production to the Silicon Forest region of northwest Oregon as that facility builds out and ramps up.

"In addition to the attractive purchase price of the building," commented Sergey Savastiouk, CEO of ALLVIA, "there is a tremendous talent pool of engineers and fab personnel in that community of Oregon. And operating expenses, particularly electricity and water, but also including taxes, are much more affordable compared to Silicon Valley."

Through-Silicon Vias

ALLVIA offers services for both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They recently announced they had secured a next round of funding, bringing the total invested in the company to $25 million. A portion of the new funds was used to purchase the Oregon facility.


Located in Silicon Valley, ALLVIA is the first through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, and CMP.


ALLVIA, Inc. ( provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:

Sergey Savastiouk, CEO

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA