First Through-Silicon Via Foundry, ALLVIA, to Present Critical Results in TSV Design, Process and Reliability at 3D Packaging Forum


Sunnyvale, California, December 1, 2009

ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on via processing and reliability during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled TSV Technology Implementation – Design, Process, and Reliability Studies for Product Applications. His discussion will address:

  • TSV technology overview
  • Critical factors and challenges in TSV design, process, and reliability
  • Implementation of TSV technology – test vehicles, reliability results, and product examples
  • Future outlook – critical needs, challenges, and the prognosis

ALLVIA has also completed the integration of a silicon interposer between a semiconductor die and a BT device and has added capacitors on the interposer. The preliminary reliability results will be presented at the conference.

Through-Silicon Vias

ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They recently announced purchasing a manufacturing facility in Hillsboro, Oregon, to implement high volume manufacturing of their products with TSV technology. Over the next several months ALLVIA will proceed with manufacturing equipment tool selection.

3D Integration & Packaging Conference

This conference series, which first appeared in 2004, has continued to provide a unique perspective of the emerging commercial opportunity in 3D integration. It combines technology and business with research developments and practical insights. The conference will be held at the Hyatt Regency San Francisco Airport Hotel in Burlingame, California, Dec. 9-11, 2009. See


ALLVIA, Inc. ( provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:

Sergey Savastiouk, CEO

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA