ALLVIA Webcast on Silicon Interposers with Through-Silicon Vias and Thin-film Capacitors

How to implement interposers with TSVs and the related reliability data

Sunnyvale, California, March 10, 2010

ALLVIA, the first through-silicon via (TSV) foundry, in conjunction with Semiconductor International magazine, will broadcast a webcast on how to build silicon interposers with embedded capacitors in 3D stacked semiconductors. The webcast is scheduled for 2 pm PDT on March 17. Interested viewers can register online at the Semiconductor International website (http://www.semiconductor.net/webcast/). The free webcast will also be archived on the site for later viewing.

Three presentations will discuss the evolution of interposers with TSVs:

Evolution of Interposers and Their Mechanical Benefits

Larry Moresco, Ph.D., DFX Solutions

Electrical Performance Benefits of Silicon Interposers

Madhavan Swaminathan, Ph.D., Georgia Institute of Technology

Silicon Interposers –Implementation and Reliability Studies

Nagesh Vodrahalli, Ph.D., ALLVIA, Inc.

Thin film capacitors & 3D Integration

Recently, ALLVIA announced that it had integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors. These topics and more will be discussed in the webcast.


About ALLVIA

ALLVIA, Inc. (http://www.allvia.com/) provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:


Sergey Savastiouk, CEO
info@allvia.com
408.212.3200

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA