ALLVIA to Present Advanced Logic Applications for Silicon Interposers and Embedded Capacitors at 3D Packaging Forum


Sunnyvale, California, December 6, 2010

ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled: "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications". His discussion will address:

  • Drivers and status: VLSI packaging and 3D technologies
  • Silicon interposer as the next logical step in the evolution of VLSI packaging
  • Implementation of silicon interposers with embedded capacitors

Through-Silicon Vias/Embedded Capacitors

ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They recently announced they have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. Capacitance values higher than 1,500 nF/cm2 have been achieved for the embedded capacitors developed for delivering power to the devices. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

3D Integration & Packaging Conference

This conference series, which first appeared in 2004, has continued to provide a unique perspective of the emerging commercial opportunity in 3D integration. It combines technology and business with research developments and practical insights. The conference will be held at the Hyatt Regency San Francisco Airport Hotel in Burlingame, California, Dec. 8-10, 2010. See


ALLVIA, Inc. ( provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:

Sergey Savastiouk, CEO

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA