ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at Packaging Forum

PRESS RELEASE

Sunnyvale, California, March 1, 2011 – ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Silicon Interposers Enable High Performance Capacitors."

The data presented in this paper will show that after several thermal cycles, planar capacitors on silicon results in stable, reliable capacitors operating at very high frequencies. Unlike an issue of parallel resonance seen with chip capacitors, planar capacitors in interposers don't exhibit this property. ALLVIA, on behalf of its foundry customers, has been conducting studies of various capacitors on silicon interposers.

Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.

Through-Silicon Vias/Embedded Capacitors

ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They have previously announced they have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

IMAPS Conference and Exhibition on Device Packaging

The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. This conference will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona, March 8-10, 2011. See their website for details.


About ALLVIA

ALLVIA, Inc. (http://www.allvia.com/) provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:


Sergey Savastiouk, CEO
info@allvia.com
408.212.3200

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA