ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at IMAPS 2011


Sunnyvale, California, September 28, 2011 – ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Microelectronics in Long Beach, CA, October 11. Dr. Sergey Savastiouk, CEO at ALLVIA, will present a discussion titled: "Embedded Capacitors on Silicon Interposers Enable Higher Frequency Applications."

Silicon interposers are being used in 3D stacked assembly applications for an increasing variety of reasons, such as reduced costs. The inclusion of an interposer opens up the option of fabricating capacitors closer to the devices they need to protect. This paper will present the results of tests and developments ALLVIA has completed on planar and trench capacitors on interposers. Test results up to 6 GHz will be detailed along with reliability results.

Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.

Through-Silicon Vias/Embedded Capacitors

ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They have previously announced they have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

IMAPS International Symposium on Microelectronics

The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. This conference, the 44th International Symposium on Microelectronics, is October 11th - 13th 2011 at the Long Beach Convention Center, Long Beach, California. See their website for details.


ALLVIA, Inc. ( provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:

Sergey Savastiouk, CEO

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA