ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego

PRESS RELEASE

Sunnyvale, California, May 29, 2012 – ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.

Silicon interposers are being used in 3D stacked assembly applications for an increasing variety of reasons, such as reduced costs. The inclusion of an interposer opens up the option of fabricating capacitors closer to the devices they need to protect. ALLVIA has recently presented results of tests and developments they have completed on planar and trench capacitors on interposers. Test results up to 6 GHz have been detailed along with reliability results.

Through-Silicon Vias/Embedded Capacitors

Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.

ECTC

This year's packaging technology conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. Registration is open online at www.ectc.net.


About ALLVIA

ALLVIA, Inc. (http://www.allvia.com/) provides Silicon and Glass Interposer and Through-Silicon Via (TSV) and TGV foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions.

A leader in TSV development, ALLVIA provides design and processing for frontside (filled) and backside (conformal plated) through silicon vias. With its full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.

Company Contact:


Sergey Savastiouk, CEO
info@allvia.com
408.212.3200

657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA