Moore's Law, the Z Dimension
This article by Allvia CEO Sergey Savastiouk, was published in the January 2000 issue of Solid State Technology.
read the article (PDF, 243k) ››This article by Allvia CEO Sergey Savastiouk, was published in the January 2000 issue of Solid State Technology.
read the article (PDF, 243k) ››This article by Allvia CEO Sergey Savastiouk, was published in the December 2008 issue of Solid State Technology. In the article Dr. Savastiouk provides an analysis of flip chip technology that gives a unique prediction for the future of TSVs.
read the article ››ALLVIA, Inc. has announced that its Through Silicon Via (TSV) Foundry is fully operational and accepting customer orders.
ALLVIA has opened a 6000 sq. ft., class 100 facility for joint TSV development projects with its customers. The facility represents an investment of more than $6 million and will serve as the primary location for support for customers throughout the world.