home

The First Through-Silicon Via (TSV) Foundry

Open the Next Dimension

ISO 9001 Certified
ITAR Registered

ALLVIA

The First Through-Silicon Via (TSV) Foundry

Foundry Services
	Silicon Interposer Design & Manufacturing
	Frontside/Filled Vias
	Backside/Conformal Vias
	Redistribution Layers
	Via Deep Etching
	Via Copper Filling
	Via Backside Opening
	Via Die Attaching

World-Class Through Silicon Via Development and Foundry Services

Time to market can be significantly decreased by utilizing ALLVIA's Through-Silicon Via expertise.

More info...

Contact us for more information about Services

ALLVIA, Inc. offers a full lineup of Silicon Interposer processing and Through-Silicon Via foundry services for customers seeking quick turn custom R&D applications. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as low volume production runs.

Through Silicon Vias (TSV) was introduced as a term in 1997. TSVs allow for the shortest electrical path between two sides of wafers or die, used for 3D die-to-die, die-to-wafer, or wafer-to-wafer stacking as well as for RF and MEMS wafer level packaging (WLP).