The First Through-Silicon Via (TSV) Foundry
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ALLVIA
The First Through-Silicon Via (TSV) Foundry
World-Class Through Silicon Via Development and Foundry Services
ALLVIA, Inc. offers a full lineup of Silicon Interposer processing and Through-Silicon Via foundry services for customers seeking quick turn custom R&D applications. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as low volume production runs.
Through Silicon Vias (TSV) was introduced as a term in 1997. TSVs allow for the shortest electrical path between two sides of wafers or die, used for 3D die-to-die, die-to-wafer, or wafer-to-wafer stacking as well as for RF and MEMS wafer level packaging (WLP).