Frontside / Filled TSV Services

Cross section of Frontside via soldered onto a pad.

ALLVIA has in-house capability to design and fabricate complete Frontside / Filled Through Silicon Vias (TSVs). Frontside / Filled TSVs are typically plated complete and void-free with copper.

Key Benefits

  • Smallest via possible
  • Creates a very short electrical path
  • Vias can be added before or after front-end processing