Open the Next Dimension
Via Die Attaching/Bumping Services
ALLVIA, Inc. has developed a proprietary technique to enable die with tight pitch vias to be easily attached to other silicon die or plastic substrates.
Key Benefits
- Easy alignment of parts
- High reliability of connections
- Ni Au plated posts
More Photos
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| Cross section of bumped wafer with TSV | Bumping of TSV on the backside |
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| Bumping of TSV on the backside | Silicon interposer attached to BT substrate |