Via Die Attaching/Bumping Services

ALLVIA, Inc. has developed a proprietary technique to enable die with tight pitch vias to be easily attached to other silicon die or plastic substrates.

Key Benefits

  • Easy alignment of parts
  • High reliability of connections
  • Ni Au plated posts

More Photos

Cross section of bumped wafer with TSV Bumping of TSV on the backside
Bumping of TSV on the backside Silicon interposer attached to BT substrate